| 朱贤辉,$2,彭 伟.紫外光固化固结磨料研磨盘研磨铜片的研究[J].轻工机械,2011,29(3): |
| 紫外光固化固结磨料研磨盘研磨铜片的研究 |
| Research on the Lapping of Copper by UV curing Fixed Abrasive Lapping Plate |
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| DOI： |
| 中文关键词: 金属加工 研磨 紫外光固化 固结磨料研磨盘 材料去除率 气孔率 |
| 英文关键词:metal processing lapping UV curing fixed abrasive lapping plate material removal rate pore rate |
| 基金项目: |
| 朱贤辉 $2 彭 伟 |
| 浙江工业大学 特种装备制造与先进加工技术教育部重点实验室 |
| 摘要点击次数: 1701 |
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| 中文摘要: |
| 采用UV固化工艺，将粒径为15 μm左右的白刚玉（氧化铝）磨料固结于光固化树脂中，通过添加NaCl来制造气孔，制备固结磨料研磨盘(FALP) 。选取工件的材料去除率(MRR)和表而粗糙度Ra来评价研磨的加工性能。对比研究了在相同粒径磨粒下的游离磨料研磨、不同气孔率的固结磨料研磨多种方法对铜片的加工性能。[HTK]实验结果表明：固结磨料研磨铜片的去除速率是游离磨料加工的5~7倍，而经前者研磨的铜片表面粗糙度Ra值为0.083 μm，大于后者的0039 μm。含添加物的固结磨料研磨盘所加工的铜片的表面粗糙度Ra值较未添加的相对较好。 |
| 英文摘要: |
| In this paper，the Fixed Abrasive Lapping Plate(FALP) embedded with Al2O3 abrasives which has a diameter of about 15 μm and pore by adding NaCl was developed through UV curing process. Material Removal Rate (MRR) and average surface roughness (Ra) are employed to evaluate the performance of lapping. Comparing studied the copper processing performance under variety methods —— free abrasive lapping with same particle size abrasives, fixed abrasive lapping with different pore rate etc. Experiment results show that the MRR of fixed abrasive is 5～7 times as much as that of conventional lapping, while the best Ra of copper by FALP is 0.083 μm, and is worse than the latter whose Ra is 0039 μm. The Ra of copper that lapped by FALP with additives is better than that without additives. |
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