| 周旭， 杨平， 毛卫平， 肖原彬.基于正交试验法的COB LED散热器优化设计[J].轻工机械,2018,36(4):76-80 |
| 基于正交试验法的COB LED散热器优化设计 |
| Optimization Design of COB LED Radiator Based on Orthogonal Test |
| |
| DOI：10.3969/j.issn.1005 2895.2018.04.016 |
| 中文关键词: COB LED 半球型散热器 正交试验 芯片温度 ANSYS Workbench |
| 英文关键词:COB LED hemispherical radiator orthogonal test chip temperature ANSYS Workbench |
| 基金项目:国家自然科学基金项目(51575246) |
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| 中文摘要: |
| 结温过高会影响寿命与可靠性，为了降低芯片温度，设计了一款带凹槽的半球型散热器。首先通过实验对模拟
仿真结果进行对比，验证了ANSYS Workbench稳态热分析模块模拟仿真的合理性，然后采用正交试验法对半球型散热器进行模拟优化设计，从翅片高度、翅片个
数、凹槽深度和翅片厚度4个方面考察了半球型散热器尺寸参数对COB LED芯片最高温度的影响，得到了一个散热效率最优的结果。优化后芯片最高温度降低到
63.705 ℃。优化后散热器体积小于太阳花型和翅型散热器，而散热效果在3者中最好。 |
| 英文摘要: |
| The high temperature of COB LED will affect its life and reliability. In order to reduce the chip temperature, a hemispherical radiator with a groove
was designed. First, the simulation results were compared with experiments and the rationality of the simulation of ANSYS Workbench thermal analysis module was verified. Then
orthogonal test method was used to simulate optimization design for the hemispherical radiator, which examined the impact of hemispherical radiator size parameters on the maximum
temperature of the COB LED chip from the fin height, fin number, groove depth, fin thickness, an optimum thermal efficiency result was obtained thereafter. Optimized chip temperature
reduced to 63.705 ℃, and the volume of the radiator was smaller than that of solar flower and the fin type radiator, and the heat dissipation effect was best among the three. |
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